Seminars

The exponential growth of data communication makes photonic integration both a necessity and a reality. Optical communication is increasingly required over shorter links, and on ever larger scales. Silicon is the favored material platform for photonics integration, due to the promise of co-integration alongside electronics and unparalleled fabrication capabilities. One of the main tasks of silicon photonics is the filtering of ultra-broadband signals, that cannot be sampled and handled directly in the optical domain.

3D printed microoptics: State of the art and future challenges

Title: “Picophotonics”

Abstract:

Optical imaging and metrology of nanostructures exhibiting Brownian motion could be possible with resolution beyond thermal fluctuations and speed to resolve their dynamics. This opens the case for picophotonics (atomic scale photonics), the science of interactions of picometer-scale objects and events with light.

It is well known for decades that light can impart momentum to charged particles in the vicinity of a third body. With nanostructured dielectric materials and ultrafast laser pulses, this momentum transfer can become highly efficient, demonstrated in 2013 in two proof-of-concept experiments. Since then, not only acceleration has been shown but also deflection and focusing based purely on optical nearfield forces. With these ingredients at hand, we are now at a point to build an on-chip particle accelerator.

Towards lab-on-a-particle platforms we suggest using mobile engineered active (“self-propelling”) carriers to revolutionize diagnostic testing and sample analysis; with advantages of the traditional lab-on-a-chip (e.g. portability, efficiency) but overcoming current challenges (e.g. complexity, predetermined design). Our novel generic active carrier, acting as a mobile floating microelectrode, uses a single externally applied electric/optical field to selectively trap, transport and deliver user-specified payload(s).