Abstract: This talk presents a unified framework that harnesses the strengths of three-dimensional (3D) integration of two-dimensional (2D) materials to enable next-generation computing technologies across memory, logic, and bio-inspired domains. I will begin by highlighting recent advances in monolithic 3D integration of 2D field-effect transistors (FETs) for high-density memory and logic, focusing on low-temperature fabrication and heterogeneous stacking. In the second part, the focus shifts to animal-inspired, ultra-low-power circuits designed using 2D materials that emulate biological functions such as auditory localization, motion detection, and collision avoidance. Drawing inspiration from barn owls, locusts, and other model organisms, we demonstrate compact, energy-efficient neuromorphic architectures that combine device-level nonlinearity, event-driven sensing, and co-located memory and processing. Together, these approaches point toward a new class of intelligent, miniaturized systems for edge computing and electronic warfare applications.
Biography: Dr. Das received his B.Eng. degree (2007) in Electronics and Telecommunication Engineering from Jadavpur University, India, and his Ph.D. degree (2013) in Electrical and Computer Engineering from Purdue University. He was a Postdoctoral Research Scholar (2013-2015) and Assistant Research Scientist (2015-2016) at Argonne National Laboratory (ANL). Dr. Das joined the Department of Engineering Science and Mechanics (ESM) at Penn State University in January 2016. Dr. Das received the Young Investigator Award from the United States Air Force Office of Scientific Research in 2017 and the National Science Foundation (NSF) CAREER award in 2021. Das Research Group at Penn State focuses on 2D microelectronics for monolithic 3D integration, bio-inspired sensing, neuromorphic computing, and hardware security.
